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October 11, 2010
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Chemical Mechanical Planarization (CMP) is the process during which precision polishing machines use a fine ceramic slurry to make water surfaces as flat (planar) as possible.

Fluid Metering’s pumps are used for both the chemical formulation of the slurry, as well as maintaining the mechanical properties of the slurry during the planarization process through the addition of hydrogen peroxide and D.I. Water.

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